According to reports, IBM announced that it has successfully developed the world's first integrated wafer-level graphite in early June , will be able to improve the performance of current wireless devices, and open up new application possibilities.
Characteristics:
IC is made by the graphene , its mixer can operate in the 10GHz frequency, thermal stability can reach 125 degrees Celsius. Analog IC which is integrated in silicon carbide (SiC) wafers of graphene transistors on a chip with a pair of inductors formed, locking the wireless communication applications.
Application:
IBM said the new technology in addition to the traditional phone and the transceiver frequency to enhance the performance of the signal, but also allow the implementation of mobile devices, higher frequency of new applications. The defense and medical researchers, can use it to develop stealth weapons or no radiation risk of medical imaging technology.
Design principles:
The successful development of IBM's chip contains a graphite graphite transistor and a pair of inductors, and its tight integration in the silicon carbide (SiC) wafer, primarily through the development of graphene can maintain the quality of the crystal Circular hierarchy process designed to overcome the obstacles, but also take into account the components and other components in a complex integrated circuit, to overcome the traditional graphite since the integrated circuit wafer manufacturing problems.
Manufacturing process:
IBM said the integrated circuit manufacturing process of graphite, the first is to impose on the silicon wafer heat annealing, the thickness of the wafer to generate the same graphite layer, and then through four metal layers and two oxide layers, making Graphite transistors on the chip, inductors and their interconnection.